BMI 2300

Specification / COA:

Usage:

• High-frequency copper-clad laminates (CCL) for 5G and high-speed communications: BMI 2300 is an oligomeric bismaleimide resin used as a matrix component in high-frequency CCL boards for 5G base stations, millimetre-wave antenna substrates, AI server interconnects, and automotive ADAS radar. Its lower melt viscosity compared to monomeric BMI systems — reflected in the shorter gel time of 165 seconds at 200 °C — allows more uniform resin flow during laminate pressing, reducing void formation and improving interlayer bonding in multi-layer CCL constructions. Combined with VBC-capped PPE oligomers, BMI 2300 contributes to thermoset networks with dielectric constant (Dk) below 3.5 and dissipation factor (Df) below 0.005 at 10 GHz, meeting the electrical performance specifications demanded by next-generation PCB laminates.
• Aerospace structural composites: BMI 2300 serves as a matrix resin for carbon fibre reinforced polymer (CFRP) composites in aerospace structures requiring continuous service temperatures above 200 °C. Its oligomeric architecture provides lower processing viscosity than monomeric bismaleimide, enabling improved fibre wet-out during resin transfer moulding (RTM) and autoclave processing. Cured laminates retain structural stiffness and interlaminar shear strength at temperatures where epoxy systems are no longer reliable, making BMI 2300 suitable for aircraft structural panels, engine nacelle components, and military airframe assemblies.
• Semiconductor encapsulants and liquid moulding compounds: The lower and broader melt range of BMI 2300 (86–90 °C actual) makes it compatible with liquid encapsulant moulding processes for power semiconductor packaging. It is used in next-generation power module encapsulants and underfill formulations where Tg above 260 °C is required to withstand thermal cycling between −55 °C and +200 °C encountered in automotive power electronics and industrial motor drives.
• High-temperature adhesives and coatings: BMI 2300 formulations are applied as structural film adhesives for CFRP-to-metal joints in hot-zone aerospace assemblies and as protective coatings for industrial equipment operating in high-temperature chemical environments. The oligomeric structure provides improved tack and handling in uncured film adhesive form compared to monomeric BMI, facilitating automated layup in aerospace composite manufacturing.

Packing: 25 kg kraft paper bags or 500 kg super sacks (FIBC). Store away from moisture and heat; packaging is sealed to preserve shelf life.

Storage: Store in a cool (below 25 °C), dry, well-ventilated area away from heat sources, direct sunlight, and moisture. Keep containers tightly sealed. Recommended shelf life: 12 months from manufacturing date when stored under recommended conditions.

Further Reading: BMI Resins from China: Grades, Applications, and Price Advantage

Related Products

• BMI 4000
• BMI 5100
• PPE (Polyphenyl ether)
• Vinylbenzyl Chloride (VBC / CMS)
• Trimesic Acid

Further Reading: BMI 2300: Applications in High-Frequency CCL and Aerospace Composites

BMI 2300 (CAS 67784-74-1) is an oligomeric bismaleimide resin derived from the condensation of aniline, formaldehyde, and maleic anhydride. Unlike monomeric bismaleimide compounds such as BMI 5100, BMI 2300 is a prepolymeric oligomer with a lower and broader melt range (70–145 °C), shorter gel time at 200 °C (165 seconds typical), and improved processability in resin transfer moulding and liquid encapsulant applications. Despite its lower processing temperature, the cured thermoset delivers a glass transition temperature exceeding 260 °C (DMA: 287 °C) and high retention of mechanical properties at elevated service temperatures — properties that make it well suited for high-frequency CCL laminate systems, aerospace CFRP structures, and power semiconductor packaging. Unifarm Chemical supplies BMI 2300 with full batch COA and SDS documentation, sourced directly from verified Chinese manufacturers.