BMI 1000

Specification / COA:

Usage:

• High-frequency copper-clad laminates (CCL) for 5G and advanced PCB: BMI 1000 is a monomeric bismaleimide widely used as a reactive crosslinker and matrix resin component in high-frequency CCL laminates for 5G base stations, millimetre-wave antenna substrates, AI server interconnects, and automotive ADAS radar systems. Its well-defined monomeric structure provides consistent reactivity and contributes to thermoset networks with high glass transition temperature (Tg > 250 °C), low dielectric constant (Dk ≈ 3.4–3.6), and low dissipation factor (Df < 0.010 at 10 GHz). BMI 1000 is frequently co-cured with diallyl bisphenol A (DABA) or blended with oligomeric BMI resins such as BMI 2300 to tune processability and final laminate properties in multi-layer PCB constructions.
• Aerospace structural composites: BMI 1000 serves as a matrix resin for carbon fibre reinforced polymer (CFRP) composites in aerospace structures requiring continuous service temperatures above 200 °C. The monomeric structure delivers a higher and sharper melt point (156–162 °C actual) compared to oligomeric systems, enabling precise processing control in autoclave moulding and resin transfer moulding (RTM). Cured laminates exhibit high interlaminar shear strength and compressive strength retention at temperatures up to 230 °C, making BMI 1000 suitable for aircraft structural panels, engine nacelle components, radomes, and military airframe assemblies where epoxy systems are inadequate.
• Cutting tools and abrasive products: BMI 1000 is used as a high-performance thermoset binder in resin-bonded cutting discs, grinding wheels, and diamond wire saw beads. Its short gel time at 200 °C (55 seconds) enables rapid hot-press moulding cycles, improving production throughput. The cured BMI matrix provides excellent heat resistance and dimensional stability under the frictional loads generated during high-speed cutting and grinding operations, outperforming conventional phenolic resin binders in demanding applications such as semiconductor wafer dicing, hard material cutting, and precision grinding of aerospace alloys.

Packing: 25 kg kraft paper bags or 500 kg super sacks (FIBC). Store away from moisture and heat; packaging is sealed to preserve shelf life.

Storage: Store in a cool (below 25 °C), dry, well-ventilated area away from heat sources, direct sunlight, and moisture. Keep containers tightly sealed. Recommended shelf life: 12 months from manufacturing date when stored under recommended conditions.

Further Reading: BMI Resins from China: Grades, Applications, and Price Advantage

Related Products

• BMI 4000
• BMI 5100
• BMI 2300
• PPE (Polyphenyl ether)
• Vinylbenzyl Chloride (VBC / CMS)

BMI 1000 (CAS 13676-54-5) is a monomeric bismaleimide compound based on the 4,4′-diaminodiphenylmethane (MDA) backbone, one of the most widely used bismaleimide monomers in high-performance thermoset applications. Unlike oligomeric systems such as BMI 2300, BMI 1000 offers a precise melt point (156–162 °C actual) and very short gel time at 200 °C (55 seconds), providing fast-cure characteristics suited to high-throughput manufacturing. Its cured thermoset delivers a glass transition temperature exceeding 250 °C, high resistance to chemical media, and low volatile emission — properties that make it well suited for CCL laminate crosslinking, aerospace CFRP matrices, and resin-bonded abrasive and cutting tool applications. Unifarm Chemical supplies BMI 1000 with full batch COA and SDS documentation, sourced directly from verified Chinese manufacturers.