Chemical name: N,N’-(4,4′-Diphenylmethane)bismaleimide
Synonyms: BMI-3000, 4,4′-Bismaleimidodiphenylmethane, N,N’-methylenedianiline bismaleimide
CAS: 3006-93-7
Type: Monomeric bismaleimide resin
Specification / COA:
| Item | Standard | COA |
| Appearance | Yellow powder | Yellow powder |
| Melting point | ≥ 200 °C | 201.8 °C |
| Ash content | ≤ 0.3% | 0.02% |
| Moisture content (75–80 °C, 2 h) | ≤ 0.5% | 0.01% |
| Acid value | ≤ 5 mgKOH/g | 1.0 |
Usage:
- High-frequency copper-clad laminates (CCL) for 5G and advanced electronics: BMI 3000 is a high-melting monomeric bismaleimide resin offering a melting point above 200 °C, enabling high-Tg thermoset networks for demanding CCL applications. It is used as a reactive component in high-frequency laminate formulations for 5G base stations, server motherboards, AI accelerator boards, and automotive ADAS radar. The high purity — acid value 1.0 mgKOH/g, ash 0.02%, moisture 0.01% — contributes to consistent dielectric performance, with cured systems achieving dielectric constant (Dk) values below 3.5 and dissipation factors (Df) below 0.005 at 10 GHz when co-reacted with PPE oligomers or VBC-capped resins.
- Aerospace structural composites: BMI 3000 serves as a matrix resin for carbon fibre reinforced polymer (CFRP) composites requiring continuous service temperatures above 200 °C. Its monomeric structure provides a well-defined melt viscosity profile for resin transfer moulding (RTM) and autoclave prepreg processing. Cured laminates exhibit high glass transition temperatures (Tg > 280 °C) and excellent retention of interlaminar shear strength at elevated temperatures, making BMI 3000 appropriate for structural aerostructures, engine nacelle components, and radar-absorbing composite panels.
- High-temperature encapsulants and underfills: The high melting point and very low volatile content of BMI 3000 make it compatible with precision encapsulation of power semiconductors and high-density interconnect packages. It is applied in underfill formulations and moulding compounds for automotive power modules, EV inverters, and industrial power electronics requiring Tg above 260 °C and stable dielectric properties through thermal cycling from −55 °C to +200 °C.
- Structural film adhesives and protective coatings: BMI 3000 is used in high-performance structural adhesives for CFRP-to-metal bonding in aerospace hot-zone assemblies and as a protective coating for industrial components exposed to chemically aggressive environments above 200 °C. Its low acid value (1.0 mgKOH/g) minimises substrate corrosion risk and supports long-term adhesion stability under demanding service conditions.
Packing: 25 kg kraft paper bags or 500 kg super sacks (FIBC). Store away from moisture and heat; packaging is sealed to preserve shelf life.
Storage: Store in a cool (below 25 °C), dry, well-ventilated area away from heat sources, direct sunlight, and moisture. Keep containers tightly sealed. Recommended shelf life: 12 months from manufacturing date when stored under recommended conditions.
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BMI 3000 (CAS 3006-93-7) is a monomeric bismaleimide resin with a melting point above 200 °C, distinguishing it from lower-melting oligomeric grades such as BMI 2300. Its high purity — characterised by an acid value of 1.0 mgKOH/g, ash content of 0.02%, and moisture below 0.01% — ensures consistent reactivity and minimal void formation during thermoset curing. Cured BMI 3000 networks deliver glass transition temperatures exceeding 280 °C and excellent retention of mechanical and dielectric properties at elevated service temperatures, making the resin suitable for high-frequency CCL laminates, aerospace CFRP structures, and power semiconductor encapsulants. Unifarm Chemical supplies BMI 3000 with full batch COA and SDS documentation, sourced directly from verified Chinese manufacturers.